Journal Of Electronic Materials Springer

February 2012 issue 2.

Journal of electronic materials springer. Journal of electronic materials. Journal of electronic materials 1996 25 11 1715 1724 solder based die attach processes used to affix gaas devices to heat spreading carriers were investigated. 0361 5235 print 1543 186x online in this issue 11 articles regular issue paper. March 2012 issue 3.

The journal of electronic materials is a peer reviewed journal that reports monthly on the science and technology of electronic materials while examining new applications for semiconductors magnetic alloys dielectrics nanoscale materials and photonic materials. Volume 31 issue 3 2002. 2d materials wbg materials growth and characterization zakaria al balushi university of california berkeley berkeley ca. Endnote styles journal of electronic materials our policy towards the use of cookies all clarivate analytics websites use cookies to improve your online experience.

Soldering reactions between in49sn and ag thick films. The microstructures of the solder materials were assessed with a focus on void formation and the response of the solder and backsurface metallization and carrier plating to the temperature cycles of die attachment and reflow. The journal of electronic materials is a monthly peer reviewed scientific journal that publishes studies research developments and applications of materials that produce electronics the editor in chief is shadi shahedipour sandvik suny polytechnic institute the ieee tms journal of electronic materials jem is jointly sponsored by the ieee electron devices society and the minerals metals. Scientific journal selector 2018 2019 we collect latest information of sci journals include issn h index citescore online submission url research area subject area submission experience etc.

A leading journal selection tool is available free of charge for authors to find the best fit for their manuscript. All volumes issues. April 2012 issue 4. Springer for research development.

Volume 40 january december 2011. The international journal of mechanical and materials engineering is a peer reviewed international and interdisciplinary journal that provides a forum for cross disciplinary research contributions covering a broad spectrum of issues pertaining to the mechanical and machining properties of materials as well as materials science and how they apply to materials used in equipment and structures. Ii vi materials and electronic devices crystallography and defects gregory brill army research laboratory adelphi md. January 2012 issue 1.

2011 electronic materials conference. Phase stability phase transformation and reactive phase formation in electronic materials. Crystal growth ishwara bhat rensselaer polytechnic institute troy ny. The journal welcomes articles on methods for preparing and evaluating the chemical physical electronic and optical properties of these materials.